CAPABILITIES
| Items | Mass Production | Sample |
| Max.Layer Count | 40 Layers | 40 Layers |
| Max.Panel Size | 27.5″x24″ | 27.5″x24″ |
| Max.Board Thickness | 3.5mm | 5.8mm |
| Min.Trace Width/Spacing | ||
| Outer Layer | 3.5/3.5mils | 3/3mils |
| Inner Layer | 3.5/3.5mils | 3/3mils |
| Min.Board Thickness | 2L:6mils | 2L:6mils |
| 4L:15mils | 4L:15mils | |
| 6L:23mils | 6L:23mils | |
| Min.SMT/BGA Pitch | 12mils for SMT | 12mils for SMT |
| 24mils for BGA | 20mils for BGA | |
| Min.Drill Size&Aspect Ratio | 0.2mm Drill for 0.8mm Thickness(4.0:1) | 0.2mm Drill for 0.8mm
Thickness(4.0:1) |
| 0.25mm Drill for 1.6mm
Thickness(6.4:1) |
0.25mm Drill for 1.6mm
Thickness(6.4:1) |
|
| 0.30mm Drill for 2.4mm
Thickness(8.0:1) |
0.30mm Drill for 2.4mm
Thickness(8.0:1) |
|
| Surface Finishes | HASL | HASL |
| Selective Immersion Tin | Selective Immersion Tin | |
| Immersion Silver | Immersion Silver | |
| Immersion Gold | Immersion Gold | |
| Hard Gold | Hard Gold | |
| OSP | OSP | |
| Gold finger | Gold finger | |
| Controlled Impedance | +/- 10% | +/-7% |
| Contouring | Routing, V-Groove, | Routing, V-Groove, |
| Beveling Punch | Beveling Punch | |
| Hole Diameter | +/- 2 mil | +/- 2 mil |
| Min.S/M Thickness | 0.4 mil | 0.6 mil |